Key Accountabilities
Mainly responsible for parts and system simulation includes structural / thermal / fluid analysis:
1. Necessary geometry pre-process, meshing and material property assignment ability, etc.
2. Create FE model, define constraints, loads, connections, etc.
3. Analysis Type: static structure analysis (interference, seal), dynamic analysis (modal, random and harmonic analysis, mechanical shock), fatigue evaluation, thermal stress analysis (CTE), multi-physics field coupling analysis (structure, thermal, CFD, electric).
4. Post-processing and reports, provide reliable conclusion and suggestions.
Key Competencies
Major in mechanical or automotive related. Practical experience in new energy vehicle/ semiconductor packaging projects, familiar with mechanical design/semiconductor packaging. Master’s degree 2-3 years of experience or bachelor’s degree 5-8 years of experience in FEA. Static and dynamic structure analysis is a must, CFD and thermal analysis is a plus In-depth understanding of physical problems, material constitutive model, structure behavior. Proficient in office software and oral & written English. Software skills: Hypermesh, Ansys and NX. Conduct simulation according to project schedule and coordinate work with mechanical engineer for supporting product design.
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