School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built on a culture of excellence, the School is renowned for its high academic standards and research. With over 3,000 undergraduates students and 2,000 graduate students it is one of the largest EEE schools in the world and ranks 4th in the field of Electrical & Electronic Engineering in the 2025 QS World University Rankings by Subjects.
Today, the School has become one of the world’s largest engineering schools that nurtures competent engineers and researchers. Each year, the School graduates over a thousand students who are ready to take on great ambitions and challenges.
For more details, please view: https://www.ntu.edu.sg/eee
We are looking for a Project Officer in AI-driven Design Automation for Advanced Packaging to develop and integrate artificial intelligence methodologies into advanced packaging electrical design. The role will focus on leveraging machine learning for design optimization, data-driven analysis and automated decision-making in next-generation chiplet and heterogeneous integration systems. This position contributes to NTU’s mission of advancing intelligent semiconductor design automation and fostering leadership in next-generation microelectronics research.
Key Responsibilities:
Lead and conduct research in applying AI and ML algorithms for signal integrity (SI) and power integrity (PI) design in advanced packaging.
Assist in formulating intelligent design workflows and AI models that improve design efficiency and reliability.
Collaborate with faculty members, research staff, and industry partners to translate AI research into practical design automation tools.
Formulate data-driven methodologies for performance prediction, assists in the physical validation of AI-enabled design framework.
Improve design methodologies through systematic learning and optimization.
Contribute to project reports and grant deliverables, ensuring progress aligns with milestones and research objectives.
Job Requirements:
Bachelor’s degree in Electrical/Electronic Engineering, Computer Engineering, or related fields.
At least 2 years of relevant experiences in Advanced Packaging.
Familiarity with 2.5D/3D Advanced Packaging technologies, signal/power integrity, and EDA tools such as HFSS, Keysight ADS, etc.
Good written and oral communication skills.
Proficiency in Python/C++ and relevant ML frameworks (e.g., PyTorch, TensorFlow, Scikit-learn).
Excellent analytical and problem-solving abilities.
Ability to work independently and develop solutions under strict timelines.
We regret to inform that only shortlisted candidates will be notified.
Hiring Institution: NTU