Join Intel as a Module Development Engineer and become a pivotal force driving cutting-edge technology development and enablement in high-volume manufacturing and future technologies.
In this role, you will play an integral part in the design and development of sophisticated manufacturing processes, enabling innovative product designs and functional requirements. Your expertise will directly contribute to Intel's leadership in advanced semiconductor technologies, empowering the company to continue its pursuit of Moore's Law and industry-leading innovation. You will collaborate with world-class teams and industry partners to shape the future of technology, delivering impactful solutions that will define the next generation of device architectures.
Key Responsibilities:
Drive technology development and enablement for both high-volume manufacturing and advanced future technologies, encompassing process integration and equipment solutions
Lead the design and development of technically sophisticated manufacturing processes and/or repair reverse engineering, including material selection, parameter optimization, equipment material handling systems (MHS), and system design
Conduct feasibility studies to meet desired device specifications using theoretical simulations and practical engineering methods
Perform pathfinding activities in support of process and hardware development, enabling manufacturing of innovative device architectures
Develop roadmaps for technologies, enabling future technological advancements while pushing industry boundaries
Collaborate with key equipment and materials suppliers to develop and implement enabling elements of advanced technologies
Recommend and implement modifications to operating equipment to improve production efficiency, manufacturing techniques, and optimize production output for existing products
Remain updated on relevant industrial process and material manufacturing trends and identify future process technology needs
Your contribution will have a direct impact on shaping the future of Intel's advanced packaging technologies. Apply now and explore how your skills and passion can drive innovation and success at Intel.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines with at least 1+ years of related experience in semiconductor processing, manufacturing processing, process development, or working in a cleanroom environment
OR
Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines with related experience in semiconductor processing, manufacturing process, process development, or working in a cleanroom environment
Preferred Qualifications:
PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines
Technical innovation and ability to deliver results on complex, time-critical technical projects
Experience with semiconductor packaging and assembly technologies
Demonstrated ability to troubleshoot and resolve complex process issues using structured problem-solving methodologies
Familiarity with semiconductor fabrication processes and corresponding analytical techniques
Experience working with advanced process control systems, data analysis tools (e.g., JMP software), or statistical process control systems
Initiative in driving continuous improvement projects and collaborating across multidisciplinary teams
Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), or other statistical methods. - Experience with direct wafer-level assembly module engineering or fab process/hardware technology development
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.