Advanced Packaging Business Strategist

Job Details:

Job Description:

Intel Foundry Services is an independent foundry business dedicated to meeting our customers' unique product needs. As the world's first Open System Foundry, we offer a comprehensive suite of services including wafer fabrication, advanced processing, packaging technology, chiplet solutions, software, and assembly/test capabilities. Our robust ecosystem helps customers build innovative silicon designs and deliver fully customizable end-to-end products from Intel's secure, resilient, and sustainable supply chain.

Note: This position is not eligible for Intel immigration sponsorship.

You will be responsible for, but not limited to:

• Develop bottom-up advanced packaging capacity models based on bottleneck tools and other critical factors.

• Formulate top-down advanced packaging industry capacity model based on revenue, cap ex, and other financial metrics.

• Synthesize top-down and bottom-up model into Intel Foundry industry supply model.

• Deliver a comprehensive supply-demand analysis of competitive foundry landscape to senior level managements.

• Author industry insight white paper to analyze the current state of competitive foundry/OSAT ecosystem with clear implications and strategic recommendation for Intel Foundry

Behavioral traits that we are looking for:

• Highly motivated, collaborative market intelligence professional.

• Ability to provide exceptional support under tight deadlines.

• Strong initiative with ability to anticipate needs and exercise sound independent judgment.

• Adaptability and comfort working independently in ambiguous or changing environments.

• Excellent verbal and written communication skills in English.

Qualifications:

Minimum Qualifications:

• 5+ years of work experience in semiconductor advanced packaging foundry and/or Outsourced Semiconductor Assembly and Test (OSAT).

• Bachelor's degree in business (e.g., finance, MBA), Engineering (e.g., EE, Computer Science), or Science (e.g., Physics, Mathematics, Statistics).

• Experience working with external parties (e.g., vendors, consultants).

• Well organized, with project management and planning skills.

• Advanced Excel, PowerPoint, Words, and Power BI skills.

Preferred Qualifications:

• 2+ years of direct experience on various 2.5D and 3DIC packaging technologies, such as but not limited to CoWoS, InFO, SoIC, EMIB, and Foveros.

• Experience with AI Data Center advanced packaging solutions.

• Basic knowledge of constraint theory and critical factors that will influence foundry capacity/outputs.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location:

Taiwan, Taipei

Additional Locations:

Taiwan, Hsinchu

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.