Technology Development Integration Engineer, RF (2026 New College Graduate)

About GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
 

New College Graduates Overview:

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.​
 

Summary of Role:

GlobalFoundries is a leading full-service semiconductor foundry with a global manufacturing footprint spanning three continents. GlobalFoundries' RF Technology Development Organization is looking for an integration engineer in developing semiconductor technologies to join our RF team in Essex Junction, VT.
 

Essential Responsibilities include:

• Responsible for development, optimization, and qualification of FEOL and BEOL semiconductor devices and processes to meet performance, cost and yield requirements
• DOE design, execution, and analysis of results.
• Partner with unit process module engineers, failure analysis and characterization team to improve device performance and yield
• Own and drive technical process problem solving.
• Interact with internal & external customers and respond to technical queries.
• Establish new technology design rules, test structures and test methodologies.
• Innovate new methods of continuous process/device improvement.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
   

Required Qualifications:

• Education – Graduating with Master’s or PhD in Electrical, Materials Science, or other relevant engineering or physical science discipline from an accredited degree program.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal)
   

Preferred Qualifications:

• 2+ Years of Experience in Silicon or SiGe BiCMOS FEOL or BEOL processing and/or semiconductor process development
• Knowledge of semiconductor device physics and/or RF fundamentals (e.g. S-parameters)
• Prior related internship or co-op experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills
• Strong planning & organizational skills

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Expected Salary Range

$79,100.00 - $145,800.00

The exact Salary will be determined based on qualifications, experience and location.