Sr Assoc Eng Failure Analysis

• Perform TEM (transmission electron microscopy) sample preparation using Focused-ion beam/Scanning Electron Microscope for semiconductor failure analysis and characterization.
• Perform pre-FIB related sample preparation such as optical microscope inspection, Si wafer navigation, chip delayering, RIE etching, sputter coating, and etc.
• This role requires to work in the 12hr night-shift pattern.
• Participate in new failure analysis techniques development and evaluation of new technologies
• Demonstrate a sense of urgency and quality mindset to support urgent and critical Fab operation requests.

•    Perform TEM (transmission electron microscopy) sample preparation using Focused-ion beam/Scanning Electron Microscope for semiconductor failure analysis and characterization.
•    Perform pre-FIB related sample preparation such as optical microscope inspection, Si wafer navigation, chip delayering, RIE etching, sputter coating, and etc. 
•    This role requires to work in the 12hr night-shift pattern. 
•    Participate in new failure analysis techniques development and evaluation of new technologies 
•    Demonstrate a sense of urgency and quality mindset to support urgent and critical Fab operation requests.