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Job / Role Summary
The Senior Engineer supports Thin Films (CVD/Diffusion) process development for advanced NAND technology by executing experiments, characterizing films, troubleshooting process and tool issues, and supporting process transfer into manufacturing. Success in this role requires strong fundamentals in thin film deposition and characterization, disciplined experimental execution (DOE/SPC), and effective collaboration across integration, metrology, failure analysis, yield, and equipment partners.
Main Responsibilities
Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
Design and execute experiments, analyze data, and communicate results in appropriate technical forums.
Perform film characterization using appropriate techniques (examples referenced: SEM, TEM, XPS, SIMS, AFM) and correlate results to process outcomes.
Support process transfer and pilot line execution, including sustaining process maturity/capability for processes under ownership.
Collaborate with multi-functional partners (Process Integration, Metrology, Surface/Characterization labs, Electrical Failure Analysis, Yield, Manufacturing, and equipment vendors/suppliers) to ensure robust processes that meet physical/electrical requirements.
Other Responsibilities
Maintain accurate documentation of experiments, process settings, and learnings; produce technical reports and summaries.
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Candidate Profile
Minimum Required Qualifications / Experience
PhD, or Master’s ≥3 yrs, or Bachelor’s ≥5 yrs of relevant experience in
Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
Demonstrated foundation in thin film deposition and characterization; R&D/PD environment readiness is important for this role.
Must-Have Technical Skills
Fundamentals of thin film deposition (CVD/Diffusion) and film characterization.
DOE/SPC basics; ability to analyze experimental data and draw conclusions.
Understanding of plasma/vacuum systems and process-chemistry relationships (where applicable).
Must-Have Soft Skills
Structured problem-solving and learning agility in an R&D environment.
Clear communication and cross-functional collaboration.
Highly Desirable / Preferred
Exposure to dielectric / carbon-based films and NAND structural/electrical requirements.
Experience working with equipment suppliers or tool qualification/transfer activities.
Embody Micron’s core values:
People – Respect, develop and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
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