Join Intel's Packaging Module Development team and play a pivotal role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will develop innovative material and design solutions that drive Intel's roadmap for next-generation assembly and packaging solutions. Your contributions will directly impact the efficiency, reliability, and quality of Intel's manufacturing operations, enabling cutting-edge technologies to thrive in competitive markets. This is an excellent opportunity to work on complex challenges, collaborate with cross-functional teams, and lead advancements that redefine industry standards.
Key Responsibilities
- Develop and qualify thermal material solutions such as Integrated Heat Spreaders (IHS) aligned with Intel's packaging technology roadmap.
- Define specifications for incoming materials that meet yield, reliability, quality and cost targets through close collaboration with internal partners (module, supply chain, design, core competency and integration teams) and external suppliers
- Develop manufacturing design rules by balancing design for performance (DFP), design for manufacturability (DFM) and design for cost (DFC) principles
- Own technical root cause finding and problem solving for material-related issues that arise during both development and high-volume manufacturing
- Continuously improve the business processes and best-known methodologies for designing and enabling high performance thermal material solutions in high volume based on evolving product requirements
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
The experience outlined above should reflect a combination of the following qualifications:
Preferred Qualifications
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.