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We are seeking a highly skilled and experienced Chip Architect to lead the definition
and documentation of next-generation ARM-based Systems-on-Chip (SoCs). This role
is central to bridging the gap between system requirements and silicon implementation,
with a strong focus on mixed-signal integration for sensing and touch interfaces within
stringent low-power and bandwidth constraints. The ideal candidate must be a hands-on
leader capable of driving detailed technical specifications, conducting rigorous power
and performance analyses, and serving as the primary architectural liaison across
diverse engineering teams. Strong hands-on RTL and scripting knowledge is a must.
Key Responsibilities
Bandwidth & Power Analysis: Lead comprehensive power and bandwidth
analysis for architectural trade-offs. Develop models to predict system
performance and power consumption (uW/MHz) and make data-driven decisions
to optimize the SoC PPA (Power, Performance, Area).
Detailed Chip Specification: Create and maintain detailed chip specification
documentation, including detailed architecture descriptions, relevant block
diagrams, timing diagrams, and expected waveforms to guide implementation
and verification teams. Working knowledge of AXI, AMBA, Serial interfaces and
memory.
ARM-based SoC Architecture: Define and drive the top-level architecture for
complex SoCs utilizing various ARM processor cores (Cortex-M, Cortex-A, etc.)
and associated system IP.
Cross-Functional Interface: Serve as the mandatory interface point and
technical lead across multiple disciplines:
o Firmware: Ensure the architecture is easily programmable and meets
real-time constraints.
o Design (Digital/Analog): Provide clear specifications and support during
implementation.
o Systems: Translate high-level use cases into concrete architectural
requirements.
o Analog: Define clear interfaces and integration strategies for mixed-signal
blocks.
o (ADCs, DACs, sensor interfaces).
o Mixed-Signal Integration: Architect the seamless integration of mixed-
signal components tailored for advanced sensing and touch applications.
o Low-Power Leadership: Champion ultra-low-power design
methodologies and architectural choices to achieve aggressive battery life
targets for portable devices.
Qualifications
o Education: Bachelor’s and 12+ years of related experience, or Master’s degree in Electrical Engineering,
Computer Engineering, or a related field and 10+ years of related experience
Experience: System engineering, or a related field, with a proven track
record of successful SoC tape-outs.
o Technical Expertise: Deep expertise in ARM architectures and system IP
(interconnects, memory systems).
o Proven experience conducting rigorous power (static/dynamic) and
bandwidth analysis for complex systems.
o Strong understanding of mixed-signal integration challenges and design
principles for sensing/touch applications.
o Documentation Skills: Excellent technical writing skills with meticulous
attention to detail in creating specifications, diagrams, and documentation.
o Soft Skills: Exceptional communication, leadership, and negotiation skills.
Must be highly effective at driving consensus and clarity across disparate
engineering disciplines.
o Work Environment & Location
o On-site Requirement: This is a full-time, hands-on role that requires the
employee to be present at the office location. There is no remote work
option available.
o Preferred Location: San Jose, CA.
o Secondary Location: Irvine, CA (Candidates willing to relocate or work
from our Irvine office may be considered).
Other Desired Experience
Touch Sensors
Mixed Signal SOC architecture
FPGA knowledge is a plus
Low power Architecture as applied to DSP
Technical Customer engagement
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $141,300 - $226,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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