We are seeking a highly motivated and technically skilled Integrator to lead the development and execution of new product/ process introduction and process transfers across factories. The ideal candidate will play a key role in ensuring that technology, platforms, and products meet certification requirements before transferring to HVM. In this position, you will be part of the Advanced Packaging Technology and Manufacturing (APTM NPI) that will drive execution of NPI builds across SiM, WPM and ATM Organizations.
The NPI integrator in APTM NPI team will have the following responsibilities:
Plans and manages technical programs or projects, will act as the primary interface between the fab and the program design team, product development team and factory teams.
Primary stakeholder in all program communications and lead the factory start up ensuring that product/performance targets are defined and the new product introduction is capable to deliver manufacturing processes to meet product requirements.
Owns the NPI roadmap for their designated program, monitors and reports progress against schedule and will serve as the SPOC for each of the new NPIs.
Strong partners with outside organizations and will be responsible for ensuring that a technical review of the product/process is conducted with stakeholders so that all process concerns are captured and addressed in a systemic manner.
NPI integrator will lead problem solving to resolve product/ process issues. Develop solutions to problems utilizing statistical knowledge and problem-solving tools.
Act as the POC for the assigned product for any communication, alignment, issue escalation etc. and work closely with the key partners such as BU (PDTs), LTD, product design teams and ATTD stakeholders, Automation, QnR to deliver holistic solutions to the problems.
Drives execution of NPI builds from initial launches to HVM readiness. Ensure that ES/PRQ/PROD requirements are met and that product meets customer expectations.
They will act as the logistical coordinator of introducing a new product into the factory by supplying the required process documentation to factory customers.
Develop and implement new NPI systems and business processes as they become ready and close any issues identified in a NPI reflection.
The candidate should exhibit the following behavioral traits:
Candidate is expected to have detailed technical understanding of new product/ process, schedule forecast and management, risk assessment and mitigation, HVM learning and consolidation.
Should possess strong experience working with and managing NPI builds in factory environment. Able to drive capacity execution efficiency accordingly.
Should be a quick learner and able to track issues and drive them to closure at all levels of the organization
Excellent verbal and written communication, and presentation skills.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience.
Minimum Qualifications:
Candidate must possess a Bachelor's degree in Chemistry, Mechanical, Materials Science, Electrical engineering or a related field of study and 6+ years of relevant work experience in semiconductor industry
-OR- Master's or PhD degree in Chemistry, Mechanical, Materials Science, Electrical engineering or a related field of study and 4+ years of relevant work experience in semiconductor industry
-OR- PhD degree in Chemistry, Mechanical, Materials Science, Electrical engineering or a related field of study and 2+ years of relevant work experience in semiconductor industry
Preferred Qualifications and skills:
Previous experience with factory NPIs or procedures.
Process Integration: Experience in integrating packaging processes with overall product manufacturing workflows.
Package Design: Experience in designing packaging solutions that meet product specifications, regulatory requirements, and customer needs.
Previous related work experience in a semiconductor foundry preferred
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US: $130,300.00-253,980.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.