We are seeking a highly motivated and technically skilled Integrator to lead the development and execution of new product/ process introduction and process transfers across factories.
The ideal candidate will play a key role in ensuring that technology, platforms, and products meet certification requirements before transferring to HVM.
The NPI integrator will be responsible for but not limited to:
Being the logistical coordinator of introducing a new product into the factory by supplying the required process documentation to factory customers.
Primary information interface between the fab and the upstream/downstream customers.
Tracking the collateral items, communicating wafer shipping to post fab customers, creating and updating the product codes in the internal systems.
Setting up lot flows, kicking off NPI Checklists for each module, starting the silicon and monitoring its progress through the process flow for set up, power-on and engineering samples until first production.
Develop and implement new NPI systems and business processes as they become ready and close any issues identified in a NPI reflection
The candidate should exhibit the following behavioral traits:
Candidates are expected to have strong understanding of a product’s life cycle, fab processing, and post fab activities.
Good understanding of key product/ process development milestones.
Should possess strong experience working with and managing NPI builds in factory environment. Able to drive capacity execution efficiency accordingly.
Should be a quick learner and able to track issues and drive them to closure at all levels of the organization
Excellent verbal and written communication, and presentation skills.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications:
Candidate must possess a Bachelor's Degree in Chemistry, Mechanical, Materials Science, Electrical engineering or a related field of study with 4+ years of experience working with engineering fundamentals,
-OR- Master's degree in chemistry, Mechanical, Materials Science, Electrical engineering or a related field of study with 3+ years of experience working with engineering fundamentals
Preferred Qualifications and skills:
Process Integration: Experience in integrating packaging processes with overall product manufacturing workflows.
Package Design: Experience in designing packaging solutions that meet product specifications, regulatory requirements, and customer needs.
Previous related work experience in a semiconductor foundry preferred
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US: $94,370.00-183,950.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.