Advanced Packaging Flagship Curriculum Internship Program

Job Details:

Job Description:

• The role is for APTM-TD (Advanced Packaging Technology Manufacturing - Technology Development) assembly module internship in Malaysia.

• Responsibilities and scopes may be quite diverse depending on the function or project assigned.

• The modules within the scope of this role include MIHL (Media, Inspection, Handling, and Lasermark), TCB (Thermal Compression Bonding, CAM (Chip Attach Module), SLAM (Second Level/Ball Attach Module), DXA (Direct Lid or Stiffener Attach), and CUF (Capillary Under Fill).

• In general, supports the development and implementation of respective assembly process for a specific module in semiconductor manufacturing.

• Collaborates with engineering teams to optimize process control methodologies and ensure production targets are met.

• The industrial exposure and technical skill learned through hands on experience and projects that support Intel business goals in a collaborative environment will enhance the students knowledge and experience for their future career undertaking.

Qualifications:

This internship is only open for the undergraduate student who has taken the Advanced Packaging Flagship Curriculum and required to undergo the internship program by USM academic plan.

Preferred Qualifications:

• Specific interest in any package assembly process (material handling systems, lasermark, inspection, chip and component attach reflow, thermal compression bonding, direct lid and stiffener attach, ball attach, etc.)

          

Job Type:

Student / Intern

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.