At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Key Responsibilities
1. Business Development & IP Sales
- Drive IP licensing growth in China, with a strong focus on Tensilica DSP and CPU technologies.
- Engage with SoC teams in automotive, AR/VR, mobile, smart speakers, TWS, and broader consumer markets.
- Identify and qualify new business opportunities, expand existing accounts, and manage the full sales cycle.
- Understand customer architecture requirements, future roadmaps, and competitive offerings to position Tensilica IP effectively.
- Work closely with China sales teams to develop and execute regional account strategies.
2. Software Partner Ecosystem Management
- Build, develop, and nurture relationships with key software vendors, including:
- AI/ML algorithm developers
- Audio/voice/ANC/beamforming software vendors
- Vision and XR software developers
- Automotive middleware and safety‑related software providers
- Advocate Tensilica DSPs by driving:
- Partner onboarding
- Technical enablement
- Performance optimization
- Joint solution and reference design development
- Expand the breadth of use cases supported on Tensilica DSPs, including:
- AI inferencing
- Audio/voice processing
- Sensor fusion
- XR/AR acceleration
- Always‑on, low‑power workloads
3. Collaboration with China Sales & FAE Teams
- Work hand‑in‑hand with the China sales organization to coordinate account strategies and engagement plans.
- Partner closely with FAE teams to:
- Support technical evaluations
- Manage benchmarking activities
- Drive proof‑of‑concept engagements
- Resolve technical blockers that influence purchasing decisions
- Provide feedback from customers and partners to guide product planning and roadmap decisions.
4. Market Intelligence & Strategic Planning
- Develop China‑specific go‑to‑market strategies for automotive and consumer segments.
- Monitor industry trends, emerging workloads, regulatory standards, and local ecosystem shifts (software and hardware).
- Represent the company at China industry conferences, partner workshops, customer summits, and semiconductor forums.
Qualifications
Required
- Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related discipline.
- 10+ years of experience in semiconductor IP, DSP/CPU/NPU technologies, SoC design, embedded software, or related business development roles.
- Strong technical understanding of DSP architectures, signal processing, embedded systems, and AI workloads.
- Proven success selling semiconductor IP or building technical business engagements in China.
- Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive domains.
- Excellent communication, negotiation, and relationship‑building skills.
- Ability to travel within China and internationally.
Preferred
- Direct experience with Tensilica DSPs or similar configurable DSP architectures.
- Existing relationships with:
- China automotive SoC vendors
- Smartphone/IoT/CE chipmakers
- AR/VR and edge‑AI solution developers
- Leading software algorithm partners
- Understanding of heterogeneous compute architectures, low‑power SoC design, or automotive functional safety (e.g., ISO26262).
We’re doing work that matters. Help us solve what others can’t.