Job Details:
Job Description:
Drives end-to-end development for silicon packaging substrate design from concept through tapeout and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon package board performance and pinout. Utilizes and defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves design rules violations to optimize package design. Completes documentation and collaterals into the product lifecycle management system of record. Communicates and responds to customer requests and participates in customer engaging events as they occur. Provides consultation concerning packaging problems and improvements in the packaging process.
Key Responsibilities:
- Perform substrate fit and routing studies to assess design, performance, and cost tradeoffs.
- Implement physical layout and routing of package designs, ensuring adherence to design rules.
- Optimize silicon-package-board performance and pinout by working closely with silicon and hardware teams.
- Define substrate design rules and conduct internal and external design reviews.
- Analyze data and resolve design rule checks (DRCs) to refine package designs.
- Drive design-for-manufacturability (DFM) strategies to enhance manufacturability and cost efficiency.
- Develop comprehensive documentation and collateral, storing them in the product lifecycle management system of record.
- Team player with experience collaborating with customers
- Communication and stakeholder management skills
Qualifications:
Minimum Qualifications
Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of experience.
Or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 3+ years of experience.
Or Phd degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics.
Experience listed above should be a combination of the following:
- Package or board design and review tools like Siemens Xpedition, Cadence Allegro Package Design, Valor NPI, AutoCAD, or SolidWorks.
- Expertise in Package Design and Development, interconnect methodologies, and/or manufacturability principles.
- Package Fundamentals.
Preferred Qualifications:
- Demonstrated ability to collaborate with cross-functional teams and optimize design tradeoffs.
- Exceptional analytical skills and a detail-oriented approach to problem-solving.
- Prior experience with substrate design rules and DRC resolution.
- Excellent communication and documentation skills to manage complex data and technical reviews.
- Familiarity with microelectronic package electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS.
- Strong analytical ability and problem-solving skills, including debugging and providing creative solutions.
- Experience with scripting using Python, VB, C, or similar languages.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, Oregon, Hillsboro
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.