Senior Technical Solutions Engineer - Advanced Packaging

Job Details:

Job Description:

About Intel Foundry

Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class design ecosystem, and a resilient global manufacturing supply chain to drive scalability and innovation.

As pioneers of Moore's Law, we continuously innovate and collaborate with an extensive partner ecosystem to advance technologies that enable our customers to create industry-leading products. Our strategic investments in geographically diverse manufacturing capabilities strengthen semiconductor supply chain resilience, particularly for advanced products. Through our technological expertise, manufacturing scale, and sustainable supply chain approach, Intel Foundry enables the world's essential computing, server, mobile, networking, and automotive systems for the AI era.

The Opportunity

Join Intel Foundry Services as a Senior Technical Solutions Engineer - Advanced Packaging  and become the cornerstone of customer success for our key Packaging and Test accounts. This critical role combines technical expertise with customer relationship management to drive adoption of Intel's advanced technology solutions, including our cutting-edge Advanced Packaging capabilities.

What You'll Do

Customer Relationship Leadership

• Serve as the primary customer interface, building trust and ensuring seamless communication throughout all engagement phases
• Act as the Voice of the Customer within Intel Foundry, advocating for customer priorities and expectations across all internal functions

Technical Consultation & Problem-Solving

• Partner directly with customers to understand packaging challenges and requirements
• Provide expert technical consultation on packaging solutions and processes
• Connect customers with Intel Foundry's technical experts for specialized insights

Cross-Functional Collaboration

• Work with Technology Development, Product Engineering, Manufacturing, Operations, and Customer Engineering teams
• Influence product and technology roadmaps through customer feedback and market insights
• Coordinate internal Intel resources to ensure customer success

Program Management & Execution

• Develop and maintain comprehensive Statements of Work (SOW) documenting requirements, commitments, deliverables, and milestones
• Manage complete customer engagement lifecycle from design award through high-volume manufacturing and end-of-life
• Track commitments, action items, and escalations while monitoring risks and dependencies
• Drive resolution of qualification and delivery issues

Communication & Reporting

• Provide clear, regular status reports to customers and leadership
• Facilitate effective communication between technical and business stakeholders

Core Competencies

• Strong communication skills
• Ability to navigate both technical and operational discussions effectively
• Strong problem-solving and analytical thinking capabilities
• Talent for explaining complex technical concepts clearly and concisely

Qualifications:

The Minimum qualifications are required to be initially considered for this position.  Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or in a related field
• 5+ years of experience in one or more of the following: Semiconductor Packaging, Assembly/Test, Backend Manufacturing, Operations, Product Engineering, Field Applications, or customer-facing engineering roles
• 8+ years of Semiconductor experience

Preferred Qualifications

• Post graduate degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field
• Experience in Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, Power Delivery, and Thermal Management
• Experience with Advanced Package Manufacturing, Bumping, Assembly, and Test processes
• Experience with DOE, FMEA, yield analysis, and failure analysis methodologies
• Project management and customer-facing experience
• Flexibility for travel as needed

Ready to make your mark? Apply today and become integral to Intel's journey toward operational excellence.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro, US, Texas, Austin

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $160,980.00-311,040.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.