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Contributes to the design and optimization of manufacturing engineering processes and factory operation. Assists in evaluating equipment performance, implementing corrective actions, and supporting process improvements. Collaborates with engineering and operations teams to enhance production efficiency and product quality. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment
Major duties and responsibilities:
o Develop and validate computational fluid dynamics (CFD) models to simulate specific assembly processes of advanced semiconductor packages. Perform simulations to evaluate flow, capillary action, porous media properties and process optimization across a wide range of package architectures.
o The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
o The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
o The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
Pursuing PhD degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with focus on computatinal fluid dynamics and two phase flows.
Preferred Qualifications:
Experience with:
Commercial CFD software such as: Ansys Fluent, Simulia Digital Rock, FlowScience Flow3D
Surface energy minimization software such as Surface Evolver.
Material characterization: Rheology, surface energy, contact angle
Machine learning AI
Semiconductor packaging
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Benefits at Intel
Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits | Intel Careers for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $72,900.00-134,800.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.