Reliability Engineer, MOL/BEOL (2026 Masters New College Graduate)

About GlobalFoundries 

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. 

New College Graduates Overview:  

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills.​ 

Summary of Role: 

As a Reliability Engineer working on the US Reliability team at Fab 8 in Malta, New York, you will be responsible for reliability characterization and evaluation for advanced CMOS technology nodes, mainly focusing on intrinsic wafer-level reliabilities such as electromigration and time dependent dielectric breakdown of MOL/BEOL interconnects. In this role, you will collaborate with Process Integration and Advanced Module Engineering for developing reliable technology solutions and assessing the reliability risk of a manufacturing process. You will provide the wafer level reliability support for technology qualification and process improvement.  

Essential Responsibilities Include: 

In this role you will be responsible for the following (including, but not limited to): 

• Request reliability tests at our lab facilities, independently perform the data analysis and preparation of a thorough summary before presenting the results to the team. 

• Process qualification focusing on MOL/BEOL reliability. 

• Engage in proactive teamwork to support cross functional milestones through collaboration with Quality, Process Integration, and Advanced Module Engineering.

• Support reliability risk assessment for manufacturing. 

• Provide wafer-level reliability expertise and consultation to Process Integration, Advanced Module Engineering, and Manufacturing. 

• Address customer requests or issues involving reliability.

Other Responsibilities: 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 

Required Qualifications: 

• Bachelor’s or Master’s Degree in Electrical Engineering, Materials Science, Physics or Related Technical Discipline.  

• Must have at least an overall 3.0 GPA and proven good academic standing. 

• English language fluency with strong written and verbal communication skills.

Preferred Qualifications:  

• Sound understanding of semiconductor devices and their operation.
• Technical expertise on semiconductor wafer-level reliability, especially of BEOL or 3D wafer bonding obtained through your educational level research and/or relevant job/internship experiences. 
• Solid knowledge of basic statistics
• Interest in coding to understand, modify and develop in-house data analysis tools.

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. 

• Demonstrated ability to work well within an international global matrixed team or environment. 

• Strong organizational skills along with demonstrated ability to manage multiple tasks simultaneously and able to react to shifting priorities to meet business needs. 

• Ph.D. with relevant experience is preferred but not required.

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Expected Salary Range

$65,400.00 - $145,800.00

The exact Salary will be determined based on qualifications, experience and location.