Packaging Module Development ENgineer

Job Details:

Job Description:

Join Intel's Advanced Packaging Technology Development organization as a Packaging Module Development Engineer. In this critical role, you will drive the development and optimization of processes and equipment that enable Intel's future assembly packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, ensuring Intel remains a leader in advanced IC packaging solutions. You will collaborate with cross-functional teams to develop innovative methods, solve complex engineering challenges, and design processes to meet quality, cost, yield, and productivity targets. This is an opportunity to shape the future of packaging technology while working within a dynamic and supportive environment that values creativity and collaboration.

Key Responsibilities

- Develop and optimize panel-level processes and equipment to enable Intel's advanced packaging technologies.
- Characterize process windows using principles of design of experiments (DOE) and analyze interactions among equipment, materials, and processes.
- Establish equipment configurations, process specifications, and workflows for new technologies, integrating them into production.
- Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity.
- Develop and maintain equipment capable of testing silicon and package technologies under simulated field conditions including heat, humidity, temperature cycling, and dynamic forces.
- Collaborate with supplier quality and procurement teams to ensure material specifications and vendor performance meet stringent quality standards.
- Lead efforts to develop novel techniques, methods, and tools to accelerate technology maturity and identify risks early in the product development cycle.
- Document advancements and improvements through technical white papers and data analysis reports.
- Partner with engineering teams and external stakeholders to address packaging challenges, ensuring alignment with Intel's roadmap.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

• MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field  and 4+ Years Relevant Experience.
• OR PHD degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field  and 2+ Years Relevant Experience

The experience listed above should be a combination of the following:

• Experience in electrochemistry, electrolytic and/or electroless processes.

Preferred Qualifications

- Experience with process development, equipment adjustment, and manufacturing process control.
- Proficiency in design of experiments (DOE) principles and statistical data analysis.
- Experience in process characterization and statistical process control.
- Familiarity with materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
- Strong analytical skills and experience troubleshooting integrated technology issues.
- Proficiency in statistical tools, process control frameworks, and Microsoft Office software suite applications.
- Experience working with organic and inorganic materials in packaging processes.

          

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.