GPS Engineer II (E2S) – Sculpta

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Salary:

$86,500.00 - $119,000.00

Location:

Gloucester,MA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Job Title

GPS Engineer II (E2S) – Sculpta

Location

Gloucester, MA
(Travel to domestic and international customer sites as required)

Business Unit

VSE BU – SPG – Sculpta

Role Summary

The GPS Engineer II (E2) – Sculpta provides technical product support for etch‑based semiconductor systems, with emphasis on vacuum and plasma chamber technologies. The role supports Field Service Engineers and customers by executing structured troubleshooting, participating in root cause analysis (RCA) activities, supporting defined system escalations, assisting with installs and upgrades, and contributing to technical documentation.

At the E2 level, the engineer operates as an independent executor within a defined problem scope, applying established methods and procedures, escalating complex or ambiguous issues appropriately, and working under guidance of senior GPS engineers and engineering teams.

Key Responsibilities

Product & System Support

• Provide technical support for Sculpta etch systems to Field Service Engineers via phone, electronic media, and on‑site support.
• Execute troubleshooting of vacuum and plasma chamber issues, including hardware, consumables, RF components, and performance‑related problems.
• Support system operation, calibration, maintenance, and recovery activities at customer sites following established procedures.
• Assist with beta tool support, new hardware introductions, and early customer deployments under defined scope.

Escalations & Root Cause Analysis

• Support L3L4 system escalations under the direction of other GPS/TPS engineers or engineering teams.
• Apply established RCA methodologies (e.g., 5‑Why, fault tree analysis, data correlation) to assigned problems.
• Collect and analyze data from logs, alarms, system sensors, process trends, and field observations.
• Identify and document contributing factors across hardware, vacuum, plasma, configuration, and operational domains.
• Document RCA findings, corrective actions, and validation results for review.
• Support implementation and verification of corrective and preventive actions (CAPA) as directed.

Vacuum & Plasma Systems Focus

• Support troubleshooting of:
  • Vacuum systems (roughing and turbo pumps, valves, seals, pressure control, leak detection)
  • Plasma chambers and associated process hardware
  • RF power delivery components and matching networks
• Assist in diagnosing plasma instability, arcing, particle generation, and chamber performance degradation.
• Support chamber health monitoring, contamination control, and preventive maintenance effectiveness.

CIP, Installs & Retrofits

• Assist with CIP upgrades, hardware retrofits, and system modifications following released documentation.
• Support on‑site installs and upgrades, including post‑install verification and issue resolution.
• Provide structured field feedback to engineering and manufacturing teams through established channels.

Documentation & Knowledge Capture

• Contribute to GPS documentation, including CENs, ISBs, BKMs, and troubleshooting procedures.
• Document RCA results, workarounds, and lessons learned from assigned field issues and escalations.
• Follow established documentation authoring, review, and release processes.

Customer & Team Interaction

• Participate in customer calls, escalation reviews, and on‑site technical discussions as required.
• Collaborate with Field Service, Engineering, Manufacturing, and senior GPS engineers.
• Communicate technical findings clearly and professionally to internal stakeholders and customers.

Travel & Work Requirements

• Willingness to travel 25–30%, including short‑notice travel for escalations.
• Ability to support off‑shift or weekend work during critical customer events, installs, or recovery efforts.
• May require extended on‑site support during escalations or ramp activities.

Qualifications

Education

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Physics, Systems Engineering, or related discipline
  or equivalent combination of education and relevant industry experience.

Experience

• 2–5 years of experience supporting etch‑based semiconductor systems in a fab, Lab, field service, or product support role.
• Hands‑on experience with vacuum and plasma‑based chambers.
• Demonstrated participation in structured root cause analysis of system‑level issues.
• Exposure to customer escalations and cross‑functional technical problem solving.

Technical Skills

• Working knowledge of:
  • Etch process fundamentals and plasma behavior
  • Vacuum system operation and chamber hardware
  • RF power delivery concepts (preferable)
• Ability to perform data‑driven troubleshooting and RCA within defined scope.
• Ability to read and interpret mechanical drawings, vacuum schematics, and electrical diagrams.
• Familiarity with semiconductor tool documentation and change control processes.

Behavioral Competencies

• Analytical and methodical problem‑solving approach.
• Clear written and verbal technical communication.
• Ability to follow established RCA processes and escalation paths.
• Willingness to learn, take ownership of assigned tasks, and operate effectively in high‑pressure fab environments.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

No

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.