Role summary
Excellence knowledge Mold, Mark/Singulation or Backend processes of semiconductor.
Lead for Mold & Backend technical expert and improvement.
Perform improvement projects, SWLF follow goals and KPI that focus improve Quality, Cost, Delivery.
Proven track record in optimizing manufacturing processes using Lean Six Sigma.
Create and review process specification example control plan, process spec, PFMEA , bonding diagram etc.
Manage Project of Mold/Backend technical team to improvement.
Job Responsibility
Drive projects Cost saving, Quality improvement and Cycle time improvement.
Troubleshoot molding/Backend processes and material or equipment issues
Provide engineering support in terms of production & quality issues to ensure issues are contained and resolved.
Prepare instructions/procedures for the assembly processes, ECN/CMT are drafted & executed.
Enhance and optimize molding/Backend processes to achieve Quality, Delivery, and Cost efficient production with Standardization.
Act as engineering resource to molding/Backend operation ensuring process standardization and Responsible for new tooling/autoloader process set up / Optimization of existing process.
Collect and analyze data on individual processes to identify and improve process capability.
Collaborate with other related departments to ensure the process / equipment maintenance activities
Job Qualification
Bachelor's or master's degree in electronic, electrical engineering or related field(work experience)
Mold or Backend process more than 10 Years experience in Semiconductor industry.
Minimum 10 years’ experience in high precision injection molding and hands-on experience in Molding/Backend Processes set up and optimization.
Leadership to improvement Mold/Backend processes
Proficient in process validation methodologies and techniques.
Strong skills in SPC tools, Cpk analysis, and DoE techniques.
Effective communication both Thai and English and organizational abilities.
Proactive mindset with project management skills.
Able to work under pressure.