Northrop Grumman Space Systems continues to push the boundaries of what is possible in space technology. Join our collaborative team of passionate engineers designing and building mission-critical space sensor payload hardware enabling national security and scientific advancements. We foster a culture where your expertise is valued and your growth is supported every day through purposeful innovation and leadership.
Position Summary
We seek an experienced Staff Mechanical Engineer (T5) to join our team within the Intelligence Systems Business Unit. The successful candidate will independently lead mechanical design, analysis, integration, and testing for RF and EO aperture and payload structure design supporting multiple high-profile satellite programs. This role is ideal for a technically accomplished and strategic engineer who thrives in fast-paced, multidisciplinary environments and is eager to take leadership responsibility beyond foundational design activities. This role will be worked out of Linthicum, MD.
Key Responsibilities
Lead end-to-end mechanical design and development of advanced antenna and electro-mechanical sensor sub-assemblies through all product lifecycle phases: concept, detailed design, fabrication, integration, test, and delivery
Develop high-fidelity 3D CAD models (Creo or Siemens NX), and generate aerospace-compliant engineering documentation
Identify, assess, and mitigate technical risks; support troubleshooting and root-cause analysis during integration and testing
Drive incorporation of digital engineering practices, including Agile/DevOps methodologies, Model-Based Systems Engineering (MBSE), simulation, and data analytics to improve engineering rigor and efficiency
Independently determine technical objectives and solutions, exercising substantial latitude in problem-solving complex and novel engineering challenges
Collaborate closely with cross-functional teams—electrical, thermal, structures, manufacturing—to ensure subsystem compatibility and manufacturability
Support and contribute to proposal technical volumes, technology roadmap creation, and process improvement initiatives within the department
Engage with customers and senior leadership in technical presentations, briefings, and program reviews, clearly articulating design rationale and status
Mentor junior and mid-level engineers, facilitate knowledge transfer, and contribute to a culture of continuous improvement
Maintain configuration and compliance with applicable quality, security (TS/SCI clearance), and industry standards
Basic Qualifications
Bachelor’s degree with 12 years of experience, a master’s degree with 10 years of experience or a PhD with 8 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields
U.S Citizenship is required
No clearance required to start, but must have the ability to obtain/maintain a DoD Top Secret w/SCI clearance
Working knowledge of materials, specifications, manufacturing processes and design tools utilized for antenna panel and supporting electronics assemblies
Proven proficiency with space-qualified mechanical hardware design in RF/EO sensor or antenna assemblies, including electro-mechanical subsystems and electronic packaging
Expert-level use of 3D CAD tools (Creo, Siemens NX)
Demonstrated ability to work independently without appreciable direction, setting and meeting technical goals aligned with program objectives
Skilled in presenting complex technical concepts to technical and non-technical stakeholders, and collaborating across disciplines and programs
Experienced in mentoring junior engineers and facilitating knowledge transfer within teams
Preferred Qualifications
Active TS/SCI clearance with polygraph preferred
Experience with classified satellite and/or payload programs or large-scale space sensor development
Familiarity with PWB mechanical integration and surface-mount technology processes
Participation in proposal preparation, technology roadmap initiatives, and Lean/Six-Sigma process improvements
Published technical papers, conference presentations, or internal award recognition