DMTS SiPh Packaging & Assembly Materials

Summary of Role: 

• This DMTS-grade position will drive GF’s industry leading Photonix platform growth into world class fully packaged electro -optical transceiver offerings utilizing 2.5D and 3D co-packaged optics form factors.  The candidate will bring a strong focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic, and thermal stress plan for chiplet and product module reliability qualification. Competency in definition of test and measurement methodology for modules capable of over 6.4Tbps data transfer is a requirement. Validated record of photonic and electrical interconnect innovation and product release/partnership with optical/electrical OSAT ecosystem is required.  

• A successful candidate would possess industry leading product definition expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions.  It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding.   

Essential Responsibilities:  

• Hands on GF technical subject matter expert for SiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts 

• Provides leadership and training of engineers in product packaging design reviews, materials selection and FMEAs of customer packaging concepts 

• Protects clients by ensuring that the maturity of a given technology, technology models, packaged design rules, and IP, meets industry expectations 

• Ensures that all new technologies and features meet a standardized set of quality expectations tied to implementation into application representative packages for Data Centers, Automotive and Communications. 

• Driving GF leadership in global SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.  

• Provides tools and complex analysis of quality issues and associated financial implications  

• Protects the business by ensuring that all necessary requirements are met and that a technology performs to the expectations of a given customer or market to avoid costly re-designs 

• Ensures standardization of site-based quality processes are executed appropriately 

• Drives increased discipline and qualification robustness through a consistent global qualification process 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs  

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications: 

• MS, or PhD + 20 or more years of experience 

• Expertise in photonic and electronic package architecture definition 

• Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing. 

• Experience in bringing packaged products from development into production for data centers, automotive and communications  

• Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging 

Preferred Qualifications:  

• A record of distinguished leadership on national and international levels such as contributing to national R&D agendas in science & technology, manufacturing. 

• Participation in industry standards boards 

• Materials science, thermal, mechanical, simulation background 

• Extensive experience with failure analysis, design of experiments, & packaging process integration