This role serves as a primary technical interface between CEG, Go-To-Market, and our customers, translating complex system-level requirements into winning custom silicon and ASIC solutions. Will work closely with key custom silicon and ASIC customers to develop and drive end-to-end product solutions that both delight the customer and drive business growth. Includes providing proof of concept solutions for proposing design alternatives that meet performance, power, area, timing, and thermal requirements. Review, challenge, and influence cross functional teams, roadmaps, and technology. Will drive technology benchmarking and key metrics to drive pre-silicon modeling for accuracy and best in class proposals that incorporate unit cost and PPA optimizations. Combines deep technical expertise with customer relationship management to drive revenue growth across wireless, networking, data center, and AI market segments.
Key Responsibilities
Serve as primary technical point of contact for strategic customers
Conduct technical discovery sessions to understand customer system-level requirements
Analyze customer use cases across AI, wireless, networking, and data center applications
Translate business requirements into technical specifications and solution architectures
Design and propose comprehensive silicon solutions that meet customer performance, power, and cost targets
Package integrated solutions spanning AI accelerators to radio frequency applications
Develop compelling technical proposals and presentations for customer engagements
Collaborate with sales teams to create winning competitive positioning
Provide expertise in System-on-Chip (SoC) design methodologies and best practices
Guide technology node selection based on performance, power, and cost optimization
Conduct technology node benchmarking and competitive analysis
Lead cross-functional design teams through solution development lifecycle
Drive project deliverables, timelines, and milestone tracking
Coordinate IP selection and integration requirements with internal and external teams
Ensure alignment between customer expectations and engineering capabilities
Drive design reviews and technical risk mitigation strategies
Required Skills/Experience
Experience in multiple domains of SoC design - backend, frontend, test, and packaging.
Experience in leading edge technology nodes
Strong understanding of design trade-offs - PPA, Cost, Technology Node, IP requirements
Excellent communication and presentation skills
Preferred Skills/Experience
Experience with AI/ML accelerator architectures and requirements
Experience leading high performance teams
Project management experience
Previous experience in foundry and/or ASIC vendor environments
Bachelors or Masters degree in Electrical Engineering, Computer Engineering, or related field
10+ Years of relevant experience in semiconductor SoC design
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US: $247,810.00-349,850.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.