Northrop Grumman Microelectronics Center (NGMC) of Mission Systems is seeking a CI Equipment Engineer or Principal CI Equipment Engineer for our Advanced Technology Lab (ATL) located just outside Baltimore, Maryland. At ATL, we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. The ideal candidate will have experience sustaining equipment at a semiconductor fab, as this role involves overseeing a portfolio of service contracts while ensuring compliance with contract terms, renewal deadlines, and performance metrics.
This role merges contract administration, equipment and process engineering, and cross‑functional leadership to maximize equipment uptime and efficiency. The successful candidate will track and manage service contracts, identify and address equipment pain points, and lead vendor escalation meetings during extended tool downtimes. Additionally, they will set expectations to drive continuous improvement initiatives, streamline processes, and ensure that corrective actions are effectively implemented to meet high fab performance standards.
This position may qualify for Extended Work Week (EWW) compensation, which provides straight time pay at the regular hourly rate for authorized hours worked beyond 80 in a biweekly pay period. EWW eligibility and approval are determined by management discretion and business needs. Additionally, a 9/80 work schedule may be available, allowing for a day off every two weeks while maintaining full-time hours to support work-life balance. Both EWW and alternative work schedules are subject to review and may change based on customer requirements and evolving business priorities.
Competencies & Attributes
Strategic Thinking: Aligns contract strategy with fab productivity goals.
Problem Solving: Quickly isolates root causes and drives corrective actions.
Stakeholder Management: Balances vendor interests with internal operational priorities.
Data‑Driven: Leverages KPI trends to make informed decisions and forecast renewal needs.
Integrity: Maintains confidentiality of proprietary equipment data and contract terms.
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This requisition may be filled as a CI Equipment Engineer or Principal CI Equipment Engineer.
Basic Qualifications for CI Equipment Engineer:
Bachelor’s degree in a STEM discipline (Science, Technology, Engineering, or Math) with 2 years of related experience; Master’s degree in a STEM discipline with 0 years related experience;
Prior experience in generating standard operating procedures (SOPs), technical reports, and corrective and preventive maintenance plans for 200mm or 300mm semiconductor equipment.
Experience contributing to CI projects designed to improve equipment performance and reliability and to maximize Mean Productive Time Between Failures (MTBF).
Excellent analytical and problem-solving skills, with the ability to work both independently and collaboratively in a team environment.
Prior experience coordinating or instructing field service engineers (FSEs) from leading semiconductor OEMs (e.g., AMAT, ASML, KLA, Onto, Raith).
U.S. Citizenship required.
The ability to obtain and maintain a DoD Top Secret/SCI clearance with Poly clearance is required.
Basic Qualifications for Principal CI Equipment Engineer:
Bachelor’s degree in a STEM discipline (Science, Technology, Engineering, or Math) with 5 years of related experience; Master’s degree in a STEM discipline with 3 years related experience; Ph.D in a STEM discipline with 1 year of related experience.
Prior experience in generating standard operating procedures (SOPs), technical reports, and corrective and preventive maintenance plans for 200mm or 300mm semiconductor equipment.
Experience contributing to CI projects designed to improve equipment performance and reliability and to maximize Mean Productive Time Between Failures (MTBF).
Excellent analytical and problem-solving skills, with the ability to work both independently and collaboratively in a team environment.
Prior experience coordinating or instructing field service engineers (FSEs) from leading semiconductor OEMs (e.g., AMAT, ASML, KLA, Onto, Raith).
U.S. Citizenship required.
The ability to obtain and maintain a DoD Top Secret/SCI clearance with Poly clearance is required.
Preferred Qualifications:
Strong understanding of wafer fabrication processes (etch, deposition, lithography, metrology, etc.).
Experience negotiating and managing service contracts with leading semiconductor OEMs.
Proficiency in data analysis, SPC, and root cause methodologies (e.g., 8D).
Advanced communication and negotiation skills, with the ability to convey complex technical concepts clearly and negotiate mutually beneficial agreements.
Skill in interpreting and modifying diagrams and schematics to troubleshoot and resolve hardware issues effectively.
Expertise in fingerprinting a wide range of equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables.
Strong understanding of experimental design methodologies, specifically full factorial and fractional factorial designs.