The Equipment Technical Engineering Group-Assembly Finish Department Manager leads the Assembly & Finish Equipment organization at Vietnam Assembly Test (VNAT), driving the transformation of Technical Engineering Group-Assembly Finish to be a best‑in‑class in Quality, Predictability, Velocity, and Affordability with winning culture of discipline execution.
This role is pivotal as VNAT transforms to become the Foundry of Choice, with relentless focus on discipline execution for operational excellence, engineering rigor, and innovation through AI/ML and advanced engineering solutions.
Key Responsibilities
1. Lead Technical Engineering Group-Assembly Finish transformation to deliver improvements and operation excellence in:
Equipment quality and stability
Predictable 24x7 factory execution
Speed of response, recovery, and ramp
Cost competitiveness and affordability
2. Own end-to-end equipment performance for Assembly and Finish, including readiness for High Volume Manufacturing (HVM), New Product Introduction (NPI), and ramp, ensuring no equipment-driven surprises.
3. Drive operation excellence through disciplined equipment sustaining execution, strong equipment expertise, CIP culture and data-driven decision making.
4. Leverage AI/ML, automation, and engineering innovation to improve tool availability, reduce repeat issues, accelerate learning, and scale best-known methods.
5. Build a strong One-Assembly culture through tight partnership with Assembly Engineering, Manufacturing, and Quality:
Shared ownership of results
Clear operating models and escalation paths
Seamless execution from design intent to factory output
6. Develop a high-performing, accountable equipment organization, with strong safety mindset, equipment technical depth, leadership bench, and inclusion across shifts.
7. Serve as the POC equipment leader interface to factory and site leadership, clearly communicating risks, tradeoffs, and recovery plans.
Minimum Bachelor's degree in Electrical, Mechanical, Mechatronics, Industrial, or related Engineering discipline.
10+ years of relevant professional experience, with a minimum of 5 years demonstrated leadership experience in semiconductor, electronics, or high-tech manufacturing environment.
Strong background in equipment engineering, sustaining, or manufacturing operations.
Proven people leadership experience managing groups and large technical teams.
Experience in Assembly / Finish / Advanced Packaging preferred.
Demonstrated ability to lead transformation in fast-paced, high-accountability environments.
Fluent English communication skills.
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