The Cross Module Integration Support Group (CMIS) within Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTD: SWA) is seeking a Manufacturing Engineer to support a primarily Shift 1 schedule. The APTD: SWA organization is responsible for developing advancements in substrate and die-embedding manufacturing technology. The CMIS team is responsible for sustaining production media, media transportation equipment, and media wash tools. The team also provides sustaining ownership of legacy material handling equipment such as strapping tools, vacuum baggers, and manual material handling tools. In this role, the Manufacturing Engineer will also support equipment and process troubleshooting, working directly with manufacturing operations and module engineering stakeholders. This is an on-site role that requires a significant amount of time spent in and around the factory floor; it is not a remote position.
Key Responsibilities (include but are not limited to):
• Ensure the safety, quality, and performance of production media, media wash, and auxiliary MHS equipment in the factory.
• Develop equipment specifications and procedures for operation and maintenance.
• Drive compliance with applicable regulations and industry standards.
• Develop engineering solutions to address current and future factory needs.
• Train engineers and technicians in the safe operation and maintenance of equipment.
Behavioral Traits and Skills:
• Customer-first mindset: Treats the factory as a customer; delivers safe, cost-effective, timely, and robust solutions while placing organizational goals above individual preferences.
• Engineering leadership: Acts as an engineering role model; commits to quality, empowers others, is available as a resource, communicates transparently, builds networks, learns continuously, and fosters teamwork and inclusion.
• Comfort with ambiguity: Thrives in a dynamic environment; prioritizes effectively, learns quickly, takes initiative, and is flexible with work hours as business needs evolve.
• Strong engineering fundamentals: Applies sound judgment and disciplined problem solving; has working knowledge of electrical schematics, piping and instrumentation diagrams (PID), commonly used measurement/diagnostic tools, and standard hand tools.
Minimum Qualifications:
• Bachelor's degree in an Engineering STEM related field (ex: Electrical Engineering, Chemistry, Chemical Engineering, Mechanical, etc.) AND 2+ years of manufacturing, semiconductor, OR semiconductor packaging experience.
This position is not eligible for Intel Immigration sponsorship.
Preferred Qualifications:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $89,010.00-125,660.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.