Advanced Packaging Process Integration

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Location:

Hsinchu,TWN, Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Key Responsibilities:

• Collaborate with cross-functional teams including process, hardware, metrology, and sensing groups for enabling process integration efforts in advanced packaging modules
• Identify and solve high-value problems (HVPs) at both APDC and customer sites using FabVantage methodologies.
• Apply data analytics to diagnose process issues and optimize performance; leverage tools like JMP, FSS, and AIx databases.
• Support AGS sales initiatives by creating value opportunities for upsell and service contract expansion.
• Document findings, create technical reports, and present solutions to internal and external stakeholders.

Required Skills & Experience:

• Technical Expertise: Strong understanding of semiconductor backend and advanced packaging processes.
• Data Analytics: Proficient in statistical analysis, DOE, and data interpretation using JMP or similar tools; experience with AIx databases is a plus.
• Problem Solving: Demonstrated ability to troubleshoot complex process issues and drive root cause analysis.
• Communication: Clear and effective verbal and written communication skills.
• Collaboration: Proven experience working in cross-functional teams and customer-facing environments.

Qualifications:

• Bachelor’s or master’s degree in engineering, Materials Science, or related field.
• 4–7 years of experience in semiconductor or advanced packaging industries.
• Hands-on experience with advanced packaging process or/and backend process integration.
• Strong analytical mindset and data-driven approach to problem solving.
• Based in or willing to relocate to Singapore

Position requires understanding of Applied Materials global Standards of Business Conduct and compliance with these standards at all times. This includes demonstrating the highest level of ethical conduct reflecting Applied Materials' core values.

 

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 20% of the Time

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.